Prof. Max Williams pioneered many of the concepts underlying our current understanding of adhesive bonds and other bimaterial systems. His contributions include: considerations of singular stress fields, fracture mechanics applications, development of blister specimens, and studies of time dependence of materials.  In recognition of Prof. Williams broad contributions to the field, this symposium will include all aspects of applications of the principles of mechanics to the field of bimaterial systems and adhesive joints.   Abstracts on recent research
developments and state-of-the-art reviews are solicited with special emphasis on the following areas:

Fracture mechanics and applications to bonded systems
Development of test methods for bonded joints
Singular stress fields and their effects on bonded joints
Time dependence and durability of bonded systems

Authors are requested to submit a one page abstract to fit on a 8.5 by 11 inch (21.5 by 28 cm) space with a 1 inch (2.5 cm) margin on all four sides. The title (16 point, bold) should be
followed by a single space, authors names (12 point, bold), and their affiliations (12 point) (complete address should be included so that interested persons can contact the authors by mail, or  e-mail), all single spaced. This header is to be followed by a single space and then the text of the abstract, 12 point and single spaced. Figures, if included in the abstract, should be simple line  drawings. Accepted abstracts will be published in the conference proceedings. In order to be included in the symposium, the abstracts are due by December 1, 1998
and should be mailed to either of the symposium organizers:
 
 

The electronic submission of abstracts is highly encouraged.